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Tender announcement for large-scale integrated circuit testing machine

by:GESTER Instruments     2021-05-12
Bidding information (reprinted on China International Bidding Network): Tender announcement for large-scale integrated circuit testing machines. 1. Bidding conditions Project overview: Fully automatic dispensers and other mechanical and electrical products procurement funds are in place or the source of funds is implemented: the implementation of the project has the description of the bidding conditions: already in place 2. The content of the bidding bidding project number: 0675-154JOC106016/28 bidding Project name: Large-scale integrated circuit testing machine Project implementation location: Jiangsu Province, China Bidding Product List (Main Equipment): Serial Number Product Name Quantity Brief Technical Specification Remarks The first package of fully automatic dispensing machine is detailed in the second package of the tender document 1 set of automatic wafer dicing machine, see the third package of the bidding documents, 2 sets of automatic open and short circuit tester, see the details of the bidding document, package 4, automatic dispensing and planting machine, 1 set of full-automatic integrated circuits in the fifth package of the bidding documents For details, please refer to the bidding documents for 1 punching machine. The sixth package of fully automatic integrated circuit plastic packaging machine is shown in the tender documents. For details, the seventh package is fully automatic ink marking machine. For details, please refer to the bidding document. The eighth package of solder paste inspection machine is for details. The 9th package of the bidding documents, 28 sets of fully automatic gold wire ball welding machines, see the tender documents, the 10th package of high-speed placement machine, 1 set of high-speed placement machines, and the 11th package of the bidding documents, 1 solder paste coating machine, for details, see the 12th package of the bidding documents, automatic 1 cutting machine and 1 semiconductor device inspection and sorting machine, see the 13th package of the bidding document for details, 2 automatic integrated circuit transmission machines, 2 for details, see the 14th package of the bidding document, 2 automatic taping machines, and 2 for details, see the 15th package of the bidding document. For details of 2 sets of integrated circuit test systems, please refer to the 16th package of the bidding documents. 1 plasma cleaning machine. For details, please refer to the 17th package of the bidding documents. 2 sets of fully automatic integrated circuit test systems. For details, please refer to the 18th package of the bidding documents. Group) 4 units are detailed in the tender document, package 19 semi-automatic direct imaging exposure machine, 1 unit is detailed in the tender document, package 20, automatic optical inspection machine, 1 unit is detailed in the tender document, package 21 fully automatic integrated circuit transmission machine, 4 units are detailed in the tender document The 22nd package of solder paste coating machine, please refer to the tender documents for details. The 23rd package of solder paste coating machine, for details, please refer to the tender documents. The 24th package of reflow soldering furnaces, for details, please refer to the tender document. See the Tender Document, package 26, 1 automatic optical inspection machine, for details, see the Tender Document, package 27, fully automatic integrated circuit test system and integrated circuit test board, 1 set, for details, see the Tender Document, package 28, large-scale integrated circuit testing machine, 1 set for details The 29th package of the bidding documents, one test sorting machine, see the 30th package of the bidding documents, one full-automatic integrated circuit tester, and one for details, see the bidding documents 3. Bidder qualification requirements The qualifications or performance of the bidder: No acceptance of the consortium Bidding: Not accept the bidding documents that have not been purchased. Whether you can participate in the bidding: No. 4. Obtaining the bidding documents Start time of the bidding documents: 2015-01-29 Ending time of the bidding documents: 2015-02-06 How to obtain the bidding documents : On-site purchase of the bidding documents. Place of purchase: 27th Floor, Xinhua Building, No. 55 Zhongshan Road, Nanjing. Price of bidding documents: ¥300/$50 Other explanation: non-refundable after sale; domestic mail order requires an additional 50 yuan, Hong Kong, Macao, Taiwan and overseas Mail order requires an additional $50. The bidding documents will be on sale from January 29, 2015 to February 6, 2015, from 9:00 to 11:00 in the morning and from 2:00 to 5:00 in the afternoon (Beijing time, except holidays). 5. Deadline for submission of bid documents (bid opening time): 2015-02-26 14:00 Place of delivery of bid documents: Jiangsu Changdian Technology Co., Ltd. lotus pond conference room (No. 275, Binjiang Middle Road, Jiangyin City) Opening place: Jiangsu Changdian Technology Co., Ltd. Lotus Pond Conference Room (No. 275, Binjiang Middle Road, Jiangyin City) 6. Bidders must complete the registration on the China International Bidding website before bidding. The results of the bid evaluation will be announced on the China International Bidding Network. 7. Contact information Tenderee: Jiangsu Changjiang Electronics Technology Co., Ltd. Address: No. 275, Binjiang Middle Road, Jiangyin City Contact person: Zhang Jian Contact information: 0510-86854189-2399 Tendering agency: Jiangsu Overseas Group International Engineering Consulting Co., Ltd. Address: Nanjing 27th Floor, Xinhua Building, No. 55 Zhongshan Road, City Contact: Fu Hailing Contact Information: 025-847959648, Remittance Method: Tendering Agency Account Opening Bank (RMB): Bank of Communications Nanjing Branch Xinjiekou Branch Tendering Agency Account Opening Bank (USD): Transportation Bank Nanjing Branch Xinjiekou Sub-branch Account Number (RMB): 320006607010141124109 Account Number (USD): 320006607146300004415
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