The supply of integrated circuit packaging equipment caused by the shortage of equipment in the chip industry

On April 14, 2021, according to English media reports, when the production capacity of 8-inch wafer fabs was tight in the second half of last year, relevant media mentioned that chip manufacturers had strong demand for 8-inch wafer manufacturing equipment, but the supply was tight and could not be satisfied. Demand has led chipmakers to turn their attention to second-hand equipment. New reports from the English media show that the equipment in the chip industry is tight, and the foundry has expanded to the packaging field. The English-language media quoted industry chain sources, reporting that the supply of integrated circuit packaging equipment is tight. Sources in this industry chain said that packaging equipment, including polishing and grinding equipment and wafer cutting equipment, is currently in tight supply and the delivery cycle has been extended. Under the circumstance that chip foundries are generally operating at full capacity and the supply of automotive chips and smartphone processors is in short supply, the orders of packaging manufacturers are expected to be quite strong. Shipments have exacerbated the tight supply of chips in some areas. The location of the integrated circuit package in the electronics pyramid is both the apex of the pyramid and the base of the pyramid. Saying it is in both positions is well-founded. But the IC is again a starting point, a basic building block that forms the basis of most electronic systems in our lives. Likewise, an IC is not just a single chip or a basic electronic structure. There are many different types of ICs (analog circuits, digital circuits, RF circuits, sensors, etc.), so the needs and requirements for packaging are also different. This article provides a comprehensive review of IC packaging technology, with a broad-based overview of the various materials and processes used to manufacture these indispensable packaging structures. The role of integrated circuit packaging equipment Integrated circuit packaging not only plays the role of electrical connection between the bonding point in the integrated circuit chip and the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a mechanical or environmental protection role for the integrated circuit chip. function, so that the integrated circuit chip can play a normal function and ensure its high stability and reliability. In short, the quality of integrated circuit packaging has a great relationship with the overall performance of the integrated circuit. Therefore, the package should have strong mechanical properties, good electrical properties, heat dissipation properties and chemical stability. Although the physical structure, application field, and number of I/Os of ICs vary greatly, the functions and functions of IC packaging are not very different, and the purpose of packaging is quite the same. as“chip protector”, packaging plays several roles, which can be summed up as two fundamental functions: (1) protect the chip from physical damage; (2) redistribute the I/O to obtain pins that are easier to handle in assembly pitch. The package also has other secondary functions, such as providing a structure that is easier to standardize, providing a heat dissipation path for the chip, and preventing the chip from generatingαSoft errors caused by particles, as well as providing a structure that is more convenient for testing and burn-in testing. The package can also be used for interconnection of multiple ICs. The interconnection can be made directly using standard interconnection techniques such as wire bonding techniques. Alternatively, the interconnect paths provided by the package, such as hybrid packaging technologies, multi-chip assemblies (MCM), system-in-package (SiP), and other methods encompassed by the broader system volume miniaturization and interconnect (VSMI) concept the interconnection path for indirect interconnection. With the continuous development of microelectromechanical systems (MEMS) devices and lab-on-chip devices, packaging has played more roles: such as limiting the chip's contact with the outside world, meeting pressure differential requirements, and meeting chemical requirements. and atmospheric environment requirements. There is also increasing interest and active involvement in optoelectronic packaging research to meet the evolving requirements of this important field. There has been a big shift in perceptions of the importance and increasing functionality of IC packaging in recent years, and IC packaging has become an area as important as IC itself. This is because, in many cases, the performance of ICs is constrained by IC packaging, and as a result, more and more attention has been paid to developing IC packaging technology to meet new challenges.

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