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Universal Instruments actively expands the Chinese market with innovative products1
Dr. Lv Zhipeng, general manager of Universal Instruments Asia, said that China is the world's largest electronics manufacturing center, and Universal Instruments is determined to increase its market share in China and accelerate its development in Asia. This year, Flexbond, a hot-pressing welding machine designed for flexible circuit board assembly, will be launched, and a brand-new concept of terminal assembly automation platform Uflex will be launched in China in the second half of next year. Universal Instruments recently held the opening ceremony of the Asian Advanced Technology Center. Dr. Lv Zhipeng said after the meeting that Universal Instruments, headquartered in the United States, has always been leading the North American market, and its market share in China needs to be improved. Seeing the huge Chinese market, Dr. Lv believes that Universal Instruments has a lot of room for growth in the Chinese market, and hopes to expand its share in the Chinese market as soon as possible. When talking about the market outlook for next year, Dr. Lu estimated that the market will maintain this year's situation, and there will be no major ups and downs. Universal Instruments will focus on several bright spots with great potential in the market, namely smart phones, large servers, automotive electronics. And wearable electronics, launched the corresponding automation platform to provide customers with a unique assembly solution direction. When talking about wearable electronics, Dr. Lu pointed out that wearable electronics are just infancy products and require flexible circuit boards to be easily worn on the body or hands, which brings great challenges to the electronics assembly industry. Such as how to assemble components on a flexible printed circuit board and connect with a hard board, etc. Dr. Lu said that the Flexbond hot-pressing welding machine that Universal Instruments just launched in April this year can meet the needs of flexible circuit board assembly, so it is very popular. He continued that Universal Instruments has received a lot of customer inquiries, ranging from requests to see a demonstration of Flexbond in operation, to provide a prototype to customers for on-site evaluation on the production line, to trial production for customers. In addition to being able to deal with wearable electronics, Dr. Lu pointed out that Flexbond can meet the demands of thin and light consumer electronics. Dr. Lu continued to say that the current laptops are getting thinner and thinner, and the current bottleneck is that the connectors cannot be made thinner. Flexbond can just handle the welding of flex boards to flex boards or hard boards, completely replacing connectors. The thickness of the laptop is not limited by the connector. When talking about the opening of the Asia Advanced Technology Center, Dr. Lu said that the regions served by the center include mainland China, Taiwan, South Korea and Japan, and its main role is to provide customized support services to customers. Dr. Lu took a Taiwanese customer as an example. This manufacturer needs to mount soft components, but ordinary nozzles cannot complete this process. It may take a month to ask the US headquarters for help. However, Universal Instruments engineers in Taiwan developed a suitable nozzle within a few days, which greatly shortened the waiting time for customers. In addition to the Asian Advanced Technology Center in Shanghai, Universal Instruments currently has engineers in Suzhou, Shenzhen and Zhongshan, who can help local EMS factories to solve production problems at any time. As for the manufacture of Universal Instruments itself, Dr. Lu emphasized that all the machines are produced in the United States and imported into China. Dr. Lu said that because Universal Instruments and equipment are precision instruments, they will only be produced in the United States to ensure product quality. In order to ensure Universal Instruments' leading edge in market technology, Dr. Lu said that the company invests 10% to 15% of its R&D budget every year. Universal Instruments Asia Advanced Technology Center, located in Shanghai's Caohejing Emerging Technology Development Zone, has set up a product demonstration center to show customers how Fuzion? High-volume production environments, how the Radial88HT radial component inserter became the benchmark for high-productivity automated through-hole machines, and how the DIMM feeder solution easily supports high-volume odd-shaped placement applications, and more.
1. ISO 5402-1: Specifies the flexometer method for testing leather flex resistance under repeated bending.
2. ISO 17694: Defines test methods for footwear upper and lining flex resistance, simulating real-world bending stress to assess long-term durability.
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Ball Burst Method (ASTM D3787): Steel ball penetration for textiles/films using testers like GT-C02-2.
Hydraulic Method (ISO 13938.1): Fluid pressure on rubber diaphragm for industrial fabrics via GT-C12A.
Pneumatic Method (ISO 13938.2): Compressed air for breathable materials tested with GT-C12B.
Results are influenced by raw materials, yarn properties,
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