Thermal Shock Test Chamber Gt-f56 Supplier

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Application

This Thermal Shock Chamber is prohibited to flammable, explosive, easy to volatile substances sample test or storage, corrosive substance sample test or storage, biological sample test or storage, strong electromagnetic emission source sample test or storage.

Structure

1.Heat preservation envelop enclosure:

(1).Outer wall material: cold-roll steel sheet stoving varnish.

(2).Inwall material: stainless steel plate SUS304.

(3).Body heat preservation material: rigid polyurethane foam and glass fiber.

(4).Door heat preservation material: glass fiber.

2.Air conditioning channel: Fan, heater, evaporator, air door and temperature sensor.
3.The standard configuration of chamber body: a lead drilling hole, locate on the left surface of the chamber body, φ50mm round hole.
4.load capacity of test chamber basket （uniform distribution): 2 sample basket, 5kg load capacity each（uniform distribution).
5.Adjusting foot and adjusting wheel: 4 adjusting feet to support the test chamber, 4 adjusting wheels to move the test chamber.
6.Thermal Shock Chamber door: single open, left hinge, right handle (reference of Test chamber outline drawing).
7.Circulating fan:
(1).High temperature/ring temperature exposure: 3φ，400W, centrifugal

(2).Low temperature exposure: 3φ，400W, centrifugal

8.Thermal shock tester control panel: Controller display screen, failure indicator, hour meter, R232 interface and over temperature protection setting device, total power switch.
9.Machine room: Refrigeration unit, drainage device, exhaust fan.
10.Power distribution control cabinet: main power leakage circuit breaker, controller, power distribution board, cooling fan, high and low temperature circle back fan motor.
11.Heater: Nickel chromium alloy strip heater,
12.Heater control mode: non-contacting periodic pulse width, SSR (solid-state relay).

13.Thermal shock test machine power line hole and drain hole: at the back of the chamber.

Product Parameters

Key Specification

Temperature range of test area	-40℃~150℃, -60℃~150℃, -65℃~150℃ ( option)
	High temperature range: +60℃~150℃
	Low temperature range: -10℃~150℃
Testing environment condition	Environment temperature: +28℃ Relative humidity: ≤ 85% In the condition of without sample in the sample chamber
Preheating temperature range	+60℃～+150℃
Heating up time	+60℃→+150℃ ≤ 40min Note: The heating up time is the performance when the high temperature chamber individually operates.
Low temperature chamber	Note: The heating up time is the performance when the high temperature chamber individually operates.
Precooling temperature range	-55℃～-10℃
Cooling time	+20℃→ -55℃≤ 70min Note: The cooling time is the performance when the low temperature chamber individually operates.
Testing method	Switch pneumatic ventilation door 2 or 3 temperature zones.
Temperature shock range	-40℃～+150℃
Temperature fluctuation	±0.5℃
Temperature departure	±2.0℃
Temperature recovery time	≤ 5min
Recovery condition (Chart One)	Sample: plastic packaged integrated circuit(uniformly distribute) Sensor: the upper side of the sample High temperature exposure: +150℃ 30 minutes Environment temperature exposure: --- Low temperature exposure: -40℃ 30 minutes Sample weight: 2.5kg

Thermal Shock Test Chamber GT-F56